The International Conference on Material Modeling—now in its ninth edition—comes to Prague. You’re welcome here: we cover a broad range of topics across theory, simulation, experiments, applications, and data‑driven approaches. The conference will take place on the Dejvice campus of the Czech Technical University in Prague, conveniently connected to the airport and about ten minutes by metro from the city centre. Material modeling has become a field of high scientific importance in recent decades. Although many conferences focus on specific materials or applications, the ICMM conference series is dedicated to material modeling in all its facets. The aim is to bring together researchers from material modeling and material characterization so that the full breadth of the discipline is represented. The modest size of ICMM9 encourages discussion and exchange between scientists who might not meet at larger events. Contributions from both theoretical and experimental perspectives are welcome. The biennial ICMM conferences started with Dortmund (2009) and have since been held in Paris, Warsaw, Berkeley, Rome, Lund, Cape Town, and London. Prague now hosts the ninth edition. Main Topics - Linear and nonlinear elasticity - Plasticity, viscoplasticity, creep, damage, fatigue, fracture - Experimental identification and material characterization - Atomistic to continuum transition on the nanoscale - Optimization and inverse problems in multiscale modeling - Coupled field problems - Cosserat, micromorphic and gradient materials - Granular materials, particle systems, heterogeneous materials - Biomechanics, biomaterials, and electronic materials - Numerical aspects of material modeling

Mini-Symposium MS002 “Advanced Materials: Computational Analysis of Properties and Performance” This is a long-standing interdisciplinary Mini-Symposium, held at WCCM 8 (Venice, Italy, 2008), WCCM 9 (Sydney, Australia, 2010), WCCM 10 (Sao Paulo, Brazil, 2012), WCCM 11 (Barcelona, Spain, 2014), WCCM 12 (Seoul, South Korea, 2016), WCCM 13 (New York, USA, 2018), WCCM 14 (Paris, France/virtual edition, 2021), WCCM 15 (Yokohama, Japan/ virtual edition, 2022) and WCCM 16 (Vancouver, Canada, 2024). Its aim is to bring together specialists in computational mechanics, mechanics and micromechanics of materials, applied mathematics, continuum mechanics, materials science, physics, biomechanics as well as mechanical, automotive, aerospace, energy and medical engineering to discuss the latest developments and trends in computational analysis of relationships between the microstructural features of advanced engineering and natural materials and their local and global behaviours as well as their effects on performance of components and structures. The topics of the Mini-Symposium include, but are not limited to, the following: • computational mechanics of advanced materials and structures; • effect of microstructure on properties and performance of advanced materials; • prediction of deformational behaviour and life-in-service of structures and components made of advanced materials; • computational methods for analysis of modern composite and nanocomposite materials; • computational models of biological and biomedical materials; • mechanics of composite materials with relaxation and phase transitions; • simulation of failure mechanisms and damage accumulation processes in advanced materials; • computational analysis of cutting of advanced materials; • numerical simulation of mechanical behaviour of materials in technological processes; • optimization problems in mechanics of advanced materials and structures. Mini-Symposium Organizer: Professor Vadim V. Silberschmidt Loughborough University, UK (e-mail V.Silberschmidt@lboro.ac.uk)